ECA | Electronic Components, Assemblies & Materials Association

 

Electronic Components, Assemblies & Materials Association

Designation
QC-301-901/US0005
Title
DT SP FIXED MULTILAYER CERAMIC CHIP CAPAC SUBCLASS 1B LEVEL E
Status
Current (or in use)
Scope
EIA Committee
IECQ
ANSI Approval
Published
3/1/1991
Comment