Designation

EIA/IS-763

Title

BARE DIE CHIP SCALE PACKAGE TAPED 8/12MM CARRIER TAPE AUTO HANDLI

Status

Current (or in use)

Scope

EIA Committee

ACH

ANSI Approval

Published

6/25/1998

Comment

This interim standard covers requirements for punched and embossed carrier taping of components such as silicon dies, bumped flip chip devices, and chip scale packages. This interim standard was formulated to rpovide orientations, dimensions and toleranc