Meeting Date	Notice	Agenda	Roster	Minutes	Attachments*
May 2-5, 2011		Agenda (PDF)			2.1 Agenda
September 28-29, 2010		09/28-29 (PDF)		09/28-29 (PDF)	Attachment 1 Attachment 2 Attachment 3 Attachment 4 Attachment 5 Attachment 6 2.1 Agenda
April 26-29, 2010		04/26-29 (PDF)		04/26-29 (PDF)	Attachment 1 Attachment 2 Attachment 3 Attachment 4 Attachment 5 Attachment 6 Attachment 7 Attachment 8 Attachemnt 9 2.1 Agenda
October 13-14, 2009		10/13-14(PDF)		10/13-14(PDF)	Attachment 1 Attachment 2 Attachment 3 Attachment 4 Attachment 5 Attachment 6 Attachment 7 Attachment 8 Attachemnt 9 Attachment 10 Attachment 11 Attachment 12 Attachment 13 Attachment 14 2.1 Agenda
August 19, 2009		08/19 (PDF)			2.1 Agenda
April 28-29, 2009		04/28-29 (PDF)		04/28-29 (PDF)	Attachment 1 Attachment 2 Attachment 3 Attachment 4 Attachment 5 Attachment 6 Attachment 7 Attachment 8 Attachemnt 9 2.1 Agenda 2.2 Agenda
October 6-9,2008		10/6-9 (PDF)		10/6-9 (PDF)	Attachment 1 Attachment 2 Attachment 3 Attachment 4 Attachment 5 Attachment 6 Attachment 7 2.1 Agenda 2.2 Agenda
March 28 - April 1, 2008		03/28-4/1 (PDF)		03/28-4/1 (PDF)	Attachment 1 Attachment 2 Attachment 3 Attachment 4 Attachment 5 Attachment 6 Attachment 7A Attachment 7B Attachment 8 Attachment 9 Attachment 10 Attachment 11 Attachment 12 Attachment 13 2.1 Agenda 2.2 Agenda
September 24-27, 2007		09/24-27 (PDF)		09/24-27 (PDF)	CE 2.2 Minutes CE 2.1 Minutes EIA Contact List ASTM Report NAVAIR Report DSCC Report CE 2.3 Report 2.1 Agenda 2.2 Agenda
April 16-19, 2007		04/16-17 (PDF)		04/16-17	CE 2.2 Minutes CE 2.1 Minutes EIA Contact List IEC Report DSCC Report ASTM Minutes ASTM Agenda NAVAIR Report 2.1 Agenda 2.2 Agenda
September 25-29, 2006		09/25-29 (PDF)		09/25-29 (PDF)	2.1 Minutes 2.9 Minutes EIA Contact List DSCC Report 2.6 Report SAE Meeting Agenda SAE Report ASTM Report 2.1 Agenda 2.9 Agenda
April 24-27, 2006		04/24-27 (PDF)		04/24-27 (PDF)	2.1 Minutes 2.9 Minutes EIA Contact List DSCC Report 2.6 Report SAE Report ASTM Report 2.1 Agenda 2.9 Agenda
October 17-20, 2005		10/17-18 (PDF)		10/17-18(PDF)	CE 2.1 Minutes CE 2.9 Minutes EIA Contact List EIA 622 Report DSCC Report SAE Report IEC Report2.1 Agenda 2.9 Agenda
May 16-17, 2005		05/16 (PDF)		05/16 (PDF)	2.1 Minutes 2.9 Minutes DSCC EIA 364 DSCC Project Status SAE Mtg. Report SAE Liaison Report IEC Trip Report ASTMB021 EIA Contact List MVD Summary 2.1 Agenda 2.9 Agenda
October 5, 2004		10/05 (PDF)		10/05 (PDF)	2.1 Agenda 2.1 Minutes 2.9 Minutes
April 19-22, 2004		04/19-22 (PDF)		04/19-22 (PDF)	2.1 Minutes 2.9 Minutes IEC Trip Report
October 8, 2003	10/08	10/08		10/08 (PDF)	Registration Form
May 12-13, 2003	5/12-13	5/12-13	5/12-13	5/12-13	Attachments 1-2
November 6-7, 2002	11/6-7	11/6-7	11/6-7	11/6-7	Attachments 1-3
April 17-18, 2002	04/17-18	04/17-18	04/17-18	04/17-18	Attachments 1-13
October 16-17, 2001	10/16-17	10/16-17	Rescheduled	Rescheduled	—
June 5-6, 2001	6/5-6	6/5-6	6/5-6	6/5-6	Attachments 1-7
February 27- March 1, 2001	2/27-3/1	2/27-3/1	2/27-3/1	2/27-3/1	Attachments 1-15
October 31- November 2, 2000	10/31-11/2	10/31-11/2	10/31-11/2	10/31-11/2	Attachments 1-12

Committee Scope: The scope of the ECA CE-2.0 National Connector and Socket Standards Committee is to provide industry leadership in defining the performance tests, and the mechanical and electrical characteristics of electronic connector products. These efforts are critical in ensuring robust commercial viability for such innovative products to enter the marketplace by enabling interchangeability of parts between multiple manufacturers of a particular product as well as standardized Test Procedures and Test Sequences. Liaison with other ECA committees, industry standards groups (such as SAE), trade groups (such as SFF) and military standards activities is also a charter activity.  Committee documents typically become Accredited National Industry Standards (ANSI).  Documents for products with international interest are submitted to the IEC (International Electrotechnical Commission) for acceptance as IEC standards.

Typical products this committee standardizes are:

I/O Connectors
Backplane Connectors
Blade and Tuning Fork Connectors
Printed Board Connectors
Rectangular Connectors
Circular Connectors
Processor, Memory and other sockets
Commercial, Industrial, Consumer, Medical and Military connectors

Through Sub-committees, the group also addresses industry test methods, terminology, plating issues, material issues, etc.  Test schedules presented in product standards may be used for qualification testing.  The committee also has Test Sequence (TS) documents which may be referenced by other standards or used for qualifications for connector products that do not have an established industry standard.

Membership in CE 2.0 and subcommittees is comprised of users, producers, military, independent test labs and other interested organizations.  Membership is open to organizations or individuals interested in the development of connector/socket product standards, test procedures and test sequences.

*Note: All attachments are PDF files unless noted otherwise

Committee Chairman: Frank Ruffino, Molex Inc.

Roster:

Member - Voting	Member - Non-Voting	Distribution List
Dave Benfer Tyco Electronics David Bouzek Tri Star Electronics Don Chambers Northrop-Grumman Alan Davis Amphenol Corporation Robert Druckenmiller FCI USA, Inc. Carl Fritz Consultant H. John Healey IBM Corporation Thomas Peel Contech Research, Inc. Kevin Rickard Amphenol Corporation Frank Ruffino Molex Inc. Ed Wypasek DLA Land and Maritime	Greg Brown Glenair, Inc. Bobby Crumb Imco Patrick Oakes Glenair, Inc. Vince Pascucci Tyco Electronics Max Peel Contech Research, Inc. William Peverill Delsen Testing Laboratories Jeffrey Toran FCI USA Inc. Cecelia Yates ECA	Bernie Aronson Glen Johnsen Deutsch Co.

To review or edit individual roster profiles, click here.
Note: Individual ID and password required.

To request to participate or receive information on this committee, please click here.