Electronic Components, Assemblies & Materials Association

Committees

P-10 Integrated Passive Devices

Next Meeting: October 6-9, 2008 Salt Lake City, UT

Meeting Date Notice Agenda Roster Minutes Attachments
October 7, 2008   10/07 (PDF)      
April 1, 2008   04/01 (PDF)   04/01 (PDF)  
September 25, 2007   09/25 (PDF)   09/25 (PDF)  
April 17, 2007   04/17 (PDF)   04/17 (PDF)  
September 25-29, 2006   09/26 (PDF)   09/26 (PDF)  
April 25, 2006   04/26 (PDF)   04/26 (PDF)  
October 17-20, 2005   10/18 (PDF)   10/18 (PDF)  
May 17, 2005   05/17 (PDF)   05/17 (PDF)  
October 5, 2004   10/05 (PDF)   10/04 (PDF)  
April 19-22, 2004   04/19-22 (PDF)   04/19-22 (PDF)  
October 6, 2003
10/06 (PDF)
April 15, 2003
October 8, 2002
10/08
10/08
April 16, 2002
October 9, 2001
April 23, 2001
October 2, 2000
10/02(PDF)
April 5, 2000

 

Committee Scope: Will provide technical support and develops standards and specifications for electronic devices using mixed passive product technologies and diodes that perform a passive, (but not limited to) e.g., a) resistors and capacitors; b) resistors and diodes; c) resistors, capacitors, and inductors.These devices may be discrete components that are "integrated" on a common substrate (hybrid) or in a carrier formed by a common manufacturing process (monolithic). Activities also include the generation of terms and definitions, review of specifications, establishment of new specification criteria, and maintenance of existing criteria relating to these devices. To accomplish these functions, the committee maintains liaison with and uses technical information from other standards development organizations (SDOs), government agencies, industry, various professional organizations, participating members, and guests.

Committee Chairman: Brian Piscitelli, KOA Speer Electronics

Roster:

Member Distribution List
Joesph Biernacki
Stackpole Electronics, Inc.

Scott Brown
KOA Speer Electronics, Inc.

Mary Carter Berrios
Kemet Electronics

Brian Crannell
Littelfuse, Inc.

Fred Froutan
Rohm Electronics

William Gisseler
TDK Corporation of America

Michael Howieson
Thin Film Technology

Nick Ilie
SAN-O Industrial Corp

Michael Lauri
IBM Corporation

Carl Lindquist
SOC America, Inc.

Laird Macomber
Cornell Dubilier

Lanney McHargue
Murata Electronics, N.A. Inc

Brian Piscitelli
KOA Speer Electronics, Inc.

John Prymak
KEMET Electronics Corporation

Chris Reynolds
AVX Corporation

Ralph Justus
Electronic Components Association


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