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Home > Technology Center > Engineering Committees > P-1 Committee Minutes
of P-1 Committee on Resistive Devices
Self-introductions
were made. Attendance was taken,
and it was determined that a quorum was present. The attendance roster
and the CTA roster are in process of being updated to reflect the most
current members present. All attendees verified the correctness of the
information on the rosters. A meeting quorum pool is defined as those members eligible to vote at a meeting: a) If a voting member is not represented at two consecutive meetings and the absence continues for the subsequent meetings, the member shall be removed from the Meeting Quorum Poll for the subsequent meetings. Upon attendance at a subsequent meeting the member shall be reinstated in the Meeting Quorum Poll and have full voting privileges at that meeting. 2.2 Approval
of Agenda 2.3 Approval of October, 2000 Meeting Minutes The following changes should be made in the 10/2000 P-1 minutes: - Move Caddy Greenidge to Others Present; remove Dave Ritchey from Others Present; and add Len Metzger, Panasonic to Members Present. Committee unanimously accepted the Minutes of the last meeting as amended. A list of active P-1 Committee projects will be attached to the minutes. Action Item 2.4 Correspondence Chair reported on
administrative letters on topics to be discussed. No changes in committee scope. 2.6 DSCC Report DSCC status report was circulated. A copy will be attached to the minutes. Action Item MIL-Std-202 will be discussed in the P-9 meeting. 3.0 Old Business PN-4547 has been published as an EIA Standard, EIA-886. 3.2 Review of PN-4548, "Thin Film Resistor Network Specification" PN-4548 has been published as an EIA Standard, EIA-887. 3.3 ESD recommendations for thick film resistors Dave Ritchey gave an overview of the prior work in this area. ESD recommendations for thick film resistors are in EIA/IS-703, "General Resistor Stress Test Qualification Specification," paragraph 4.19. Summary results are based on data from 3 manufacturers and makes use of the human body test model. Failures have been observed when testing, but no failures have occurred in actual use. A retest was conducted including 5 vendors and 5 sizes (0402 to 2512). Major determinant of failure was degree of trim. The more trimming the larger the shift in values. However no reported problems in actual use in over 10 years. It was agreed that the Test Committee would author a White Paper on this topic for distribution at the next meeting. Committee to review white paper at the end of August. Action Item 3.4 Lead Free issue No action taken on VRI letter. Not the group they were looking for. Lead Free will be covered in detail at tomorrow's U-1 meeting in a round table discussion. 3.5 Bulk Feeders - Mike Griffith
reported that IEC will follow the Japanese initiatives. Consensus is
that resistor usage is minimal. Resistors are now mostly tape and reel.
There is also a perception that there are solderability implications
and other negatives. Committee will continue to monitor this issue. 4.1 Possible Test Standards for Flex Circuits. No manufacturer of flex circuits was able to attend to help better define the problem, Issue for the next committee meeting. 4.2 Update of proposed changes to MIL-STD-202 Will be covered in P-9 meeting. 4.3 EIA/IS-703, "General Resistor Stress Test Qualification Specification," Review ESD test in EIA/IS-703. Do we want it to match the approach in AEC-Q200-REV B matrix? Also look at IEC-801. 4.4 Other New Business Nick Marshall had a series of questions 0201 chips. Who has capability to install? What are the tolerance requirements? Who is getting into it? What outlines are available? After further discussion, the following motion was made. Motion: - To add 0201 implementation issues to the agenda for future consideration. Results of motion. Motion carried unanimously. Action Item 4.5 Review of P-1 Active Projects Motion: - To remove
PN-3178, PN-3180, and PN-3809 covering EIA-576-A, EIA-575-A, and CB-15
from active project list. Brian Piscitelli to review EIA-576-A, EIA-575-A, and CB-15 and decide if they need to be revised. Action Item 5.0 Next Meeting The next meeting will be at the 3rd Engineering Summit 10/8-10/2001 in Philadelphia at the Loews Hotel. 6.0 Adjournment The Committee moved, seconded, and unanimously agreed to adjourn at 3:21 PM. 7.0 Action Items A list of active P-1 Committee projects will be attached to the minutes. DSCC status report will be attached to the minutes. Committee White Paper on ESD recommendations for thick film resistors. To add 0201 implementation issues to the agenda for future consideration. To remove PN-3178, PN-3180, and PN-3809 covering EIA-576-A, EIA-575-A, and CB-15 from active project list. Brian Piscitelli to review EIA-576-A, EIA-575-A, and CB-15 and decide if they need to be revised.
This meeting was
conducted in accordance with the EIA legal guidelines and the manual
of organization and procedures. Brian Piscitelli,
Chairperson Michael Griffith/Michael
Tinkleman, Secretary
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