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Minutes of JT-32 Committee on Electron Tube Safety
September 21, 2001
Radisson Corning, Corning, NY

Name
Organization
Members Present
Robert D. Tolliver Clinton Electronics Corp.
Philip J. Goldman Corning Asahi Video Products
Philip Goldman Corning Asahi Video Products
Robert Taylor Schott Glass Export GmbH
Brian S. McDaniel Techneglas
Larry Schmid for Tom Watson Techneglas
Harry Swank Thomson Multimedia Inc.
Daniel Stamp for Michael D. Milostan Toshiba Am. Elec. Components, Inc.
Members Absent
Derek E. Brannon Hitachi Electronic Devices (USA), Inc.
David J. Rigdon Philips Display Components Co.
Tad Kowalski American Matsushita Elec. Corp.
Others Present
Edward F. Mikoski, Jr. EIA

1.0 Committee Organization and Membership
1.1 Agenda additions, changes and priorities
1.1.1 Add an additional agenda item 2.3 Recognition of the new International Safety Standard
1.2 Membership Changes
1.2.1 Larry Schmid is now the Primary Representative for Techneglas. Brian McDaniel will be the alternate for Techneglas.
1.2.2 ECA to check on replacing the previous rep from Philips who has retired. Philips has no participation in the JT committees
1.2.3 Note was made to remove Bill McLaughlin (Schott Corporation) from the committee membership roster report, since he has not participated in years.
1.3 Approval of minutes from June meeting
1.3.1 The minutes of the 0 June 2001 meeting in San Jose, CA were unanimously approved.
1.4 Correspondence
1.4.1 There was no official correspondence to the committee since the last meeting.
1.5 Committee Coordination
1.5.1 The Electron Device Standards Council (EDSC), which oversees the JT committees, has not met in the recent past. This body will meet if there is an issue raised concerning the JT committees and that meeting will be at the call of the Chair.
1.6 There was no interest by JT 31 to meet during this timeframe in Corning in conjunction with JT-6 and JT-32. JT-31 plans to meet May 2002 in Boston in conjunction with the SID show.

2.0 International Safety Standards
2.1 IEC 61965 Impact Testing Standard. The IEC document on CRT Mechanical Safety ; IEC 61965 has been approved all the way through the system. UL and CSA have both accepted the document in its entirety. CSA will allow certification to the old standard until 2003 at the option of the company submitting request for certification. UL has not yet published their equivalent of the International document and the cutoff date has not been announced, but will likely be the same timeframe as CSA.
2.2 IEC/TC39/WG2 X-Radiation Standard Task Force Report
A Draft revision of TEP-197-B (Marked as Rev 2001.2) was distributed to the committee. Members reviewed the document for editorial errors and were encouraged to review it in more detail before the upcoming IEC meeting in Vancouver. The Task Force is comprised of Mike Chenowith, Bill Rowe, and Bob Tolliver. The document is a reformatted version of the previous published document. It is in the process of reformatting to fit better with the IEC format so that it can be introduced as a US contribution for a potential IEC document on X radiation. The unanswered question is to how to fold in the European standard, which is a different process than that of the US. Conceivably there will be two sections created and the manufacturer submitting data for approvals would make the choice as to how it would be listed. It was stated that the US standard is far more stringent than the European governments require.
2.3 Status of IEC 61965 Acceptance. The group must wait and see how other bodies will accept testing certification to the standard. It is a question of administrative mechanism to put the process in effect. BSI indicates they will likely support it also. Details as to how to accept testing results is unknown as of yet. There is a question as to which agencies will accept the testing. VDE does not write standards of its own. IEC 65 used to cover this, but now 61965 is a stand-alone document. Some answers should begin to solidify at the upcoming meetings in Vancouver. The committee was unsure of the relationship between BSI and BEAB (British Electrotechnical Approvals Board). Rob Taylor has been doing some coordination with CSA. It appears that the testing under the new standard will not change significantly but the documentation requirements will change. The Follow-Up Services process will apparently change also. In the past there was no standardized reporting procedure so it varied from office to office. China has not yet accepted work regarding agency acceptance letters. If anyone on the committee gets any new information on any agencies, please submit it to Rob Taylor for compilation.

3.0 Standards and Document review
3.1 Nothing to be reviewed at present. All documents are up to date.

4.0 Environmental Issues
4.1 The EIA Environmental Issues Council is active on pertinent issues. The committee has not recently interfaced with the EIA. It was stated that some internationally owned companies are sending damaged product back to the tube makers in the US and the product is in a holding facility. The Product is being returned in inadequate packaging. The packaging arrives broken in tractor trailers. There is the question of what would happen in a road accident? Would the product remain contained or not? The committee is interested in finding out if there are relevant packaging regulations.

5.0 New Business
5.1 For clarification, the present TAG to IEC/TC39 is primarily composed of three members; Harry Swank, Bob Tolliver, and Bill Rowe.

6.0 Next Meeting
6.1 The next full committee meeting is tentatively scheduled in conjunction with JT-06. To be held at the Chaparral Suites in Scottsdale, AZ either Mon-Tues 28 & 29 JAN 2002 or as a backup date Thurs Fri 1 & 2 Feb 2002. Mikoski will work with ECA staff to arrange for the hotel and report back to the chairman.

7.0 Adjournment
7.1 The meeting was adjourned at 11:55 AM

This meeting was conducted in accordance with the EIA legal guidelines and the manual of organization and procedures.

 

Robert D. Tolliver, Chairperson
Signature on file

Edward F. Mikoski, Jr., Acting Secretary
Signature on file

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