ECA | Electronic Components Association

 

Electronic Components, Assemblies & Materials Association

Committees

STPC

Next Meeting: October 6-9, 2008 Salt Lake City, UT

Meeting Date Notice Agenda Roster Minutes Attachments
April 30, 2009   04/30 (PDF)   04/30 (PDF)  
October 8, 2008   10/08 (PDF)   10/08 (PDF)  
April 2, 2008   04/02 (PDF)   04/02 (PDF)  
September 26, 2007   09/26 (PDF)   09/26 (PDF) 09/26 (PowerPoint)
May 18, 2005   05/18 (PDF)      
October 6, 2004   10/06 (PDF)      
April 21, 2004 >— 04/21(PDF)
October 8, 2003  
10/08 (PDF)

Committee Scope:

Committee Chairman: Mike Lauri, IBM Corp.

Roster:

Member Distribution List
Michael Cannon
TDK Corporation of America

Scott Carter
TEK-PAK,INC.

Mary Carter Berrios
Kemet Electronics

Michael Everett
Maxwell Technologies

William Gisseler
TDK Corporation of America

Michael Lauri
IBM Corporation

Laird Macomber
Cornell Dubilier

Lanney McHargue
Murata Electronics, N.A. Inc

Brian Piscitelli
KOA Speer Electronics, Inc.

David Richardson
Vishay Intertechnology, Inc.

Doug Romm
Texas Instruments, Inc.

Frank Ruffino
Molex Inc.

Jayson Young
Kemet Electronics


For a list of all standards or projects assigned to this committee, click here.

To review or edit individual roster profiles, click here.
Note: Individual ID required.

To request to participate or receive information on this committee, please click here.