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CE-4.0 RF Connectors Committee

June 21, 2001
EIA/ECA Headquarters
Arlington, VA

1. New gasket material, fluorosilicone compound L449-65

2. Review of MSMP interface.

3. Review of TK interface.

4. Review of final interface version for:

BNC 75 Ohm Pin and Socket.
SMB 75 Ohm Air dielectric, High density and large boby version.
Screw On 75 Ohm.
MCX 50 Ohm
MMCX 50 Ohm
N Type 75 Ohm
SMA 75 Ohm
TNC 75 Ohm - The shrouded version is not being considered.

5. Date and location of next meeting.

The meeting will be held at the EIA Building 2500 Wilson Boulevard, Arlington, VA 22201.

The meeting will begin promptly at 9:00 AM and conclude at 4:30 PM.

Please notify the Chairman by email (jschim@aepconnectors.com) if you plan to attend the meeting. Include your email address if responding by mail as meeting materials will be forwarded by email.

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