CE-3.0 Sockets
Standards and Projects
Found 197 matches:
| EIA-367-1 -- ADDENDUM NO. 1 TO EIA-367 |
| CB5-1 -- ADDENDUM TO BULLETIN NO.5 |
| EIA-415-1 -- APPLICATION GUIDE FOR IC SOCKETS |
| EIA-540AD00 -- B D SPEC-ADAPTER CARRIER QUAD FLAT PACK ARRAY SOCK |
| EIA-156-B -- BATTERY SOCKET PATTERNS |
| EIA-540BA00 -- BDS FOR MECH ACTIVATED SOCKETS PIN GRID ARRAY DEVC |
| EIA-540AB00 -- BDS FOR PLASTIC QUAD FLATPACK SOCKETS |
| EIA-540AC00 -- BDS PLASTIC CHIP CARRIER SOCKETS PKG J TYPE LEADS |
| EIA-540HA00 -- BK DT SP BURN-IN SOCKET USED WITH BALL GRID ARRAY DEVICES |
| EIA-540AA00 -- BL DET SPEC-LEADLESS CHIP CARRIER SOCKET LEADLESS |
| EIA-540DB00 -- BLANK DETAIL SPEC FOR DIP SOCKETS W/DECOUPLING CAP |
| EIA-540FA00 -- BLANK DETAIL SPEC FOR MULTI-PACKAGE MODULE SOCKETS |
| -- BLANK DETAIL SPEC. ON QUAD FLAT PACT SOCKETS |
| EIA-540DA00 -- BLANK DETAIL SPECIFICATION FOR DIP SOCKETS |
| EIA-540EA00 -- BLANK DETAIL SPECIFICATION FOR ROUND STYLE SOCKETS |
| EIA-540CA00 -- BLANK DETAIL SPECIFICATION ON RELAY SOCKETS |
| EIA-540HA00 -- BLK DET SP BURN-IN SOCKETS USED W/BALL GRID ARRAY DEVICES |
| EIA-540HA00 -- BLK DET SPEC BURN-IN SOCKETS W/BALL GRID ARRAY DEVICES |
| -- BLK DET SPEC FOR MEMORY CARD CONNECTORS FOR USE IN ELEC EQUIP |
| EIA-540GA00 -- BLK DETL SPEC BURN-IN SOCKET CHIP CARRIER PKG MOLDED CARRIER RING |
| EIA-540GA00 -- BLK DT BURN-IN SOCKETS MOLDED CARRIER RINGS |
| EIA-540FA00-A -- BLK DT SP MULIT-PACKAGE MODULE SOCKETS USE IN ELECTRONIC EQUIP |
| EIA-540DB00 -- BLK SPEC IDENTIFICATION DECOUPLING CAPACITOR DIP SOCKETS |
| -- BURN-IN SOCKETS |
| EIA-773 -- CHECK LIST FOR DOCUMENTATION DEVELOPMENT AND REVISION |
| -- CONTACT TERMINATION FINISH SURFACE MOUNT CONNECTOR |
| EIA-540FAAF -- DE SP 8-BYTE, 168 POS DUAL IN-LINE MEMORY MODULE SOCKET 1.27 MM |
| EIA-167-C -- DESIGNATION FOR RECEIVER TYPE TUBE SOCKET |
| EIA-540HAAA -- DET SP FOR BURN-IN SOCKETS USED WITH BALL GRID ARRAY DEVICES |
| EIA-540JAAA -- DET SP FOR BURN-IN SOCKETS USED WITH BALL GRID ARRAY DEVICES |
| EIA-540BAAA-A -- DET SP MECH ACTUATED SOCKETS PIN GRID ARRAY 2.54 MM X 2.54 MM |
| EIA-540FAAB -- DET SP MULTI-PACKAGE 100 MIL PITCH, ANGLED MOUNT MODULE SOCKETS |
| EIA-540FAAD -- DET SP MULTI-PACKAGE 50 MIL PITCH, ANGLED MOUNT FORMAT MOD SOCKET |
| EIA-540FAAD -- DET SP MULTI-PACKAGE 50 MIL PITCH, ANGLED MOUNT MODULE SOCKETS |
| EIA-540FAAC -- DET SP MULTI-PACKAGE 50 MIL PITCH,VERT MOUNTING FORMAT MOD SOCKET |
| EIA-540FAAB -- DET SP MULTI-PACKAGE MODULE SOCKETS 100 MIL PITCH ANGLED MOUNTING |
| EIA-540B0AE -- DET SP PRODUCTION LAND GRID ARRAY (LGA) SOCKETS |
| EIA-700A0AB -- DET SPEC 1.27 MM PITCH CIRCUIT MEMORY CARD INTERCONNECT SYSTEM |
| EIA-540GAAA -- DET SPEC BURN-IN SOCKET CHIP CARRIER PACKAGE-MOLDED CARRIER RING |
| EIA-540DAAA-A -- DET SPEC DUAL IN-LINE TWO-PIECE CONTACT SOCKET |
| EIA-540GAAA -- DET SPEC FOR BURN-IN SOCKETS CHIP CARRIER PACKAGES |
| EIA-540DAAB -- DET SPEC FOR FLEXIBLE CARRIER TWO-PIECE DIP SOCKET |
| EIA-540BAAA-B -- DET SPEC MECHANICALLY ACTUATED SOCKET PIN GRID ARRAY |
| EIA-540FAAA -- DET SPEC MULTI-PACKAGE 100 MIL PITCH, VERTICAL MOUNT MOD SOCKETS |
| EIA-540BAAA -- DET SPEC ON PIN GRID ARRAY SOCKET-MECHAN ACTIVATED |
| EIA-540B0AA -- DET SPEC PRODUCTION BALL GRID ARRAY SOCKETS 1.27 MM (0.050 IN) |
| EIA-540CAAA -- DET. SPEC - RELAY SOCKETS 10 AMPS - BAL ARM RELAY |
| EIA-540D0AA -- DET. SPEC - SOCKETS FOR DUAL...PACKAGES |
| EIA-540AAAA -- DET. SPEC. ON LEADLESS CHIP CARRIERS SOCKETS |
| EIA-540DBAA -- DETAIL SPEC DECOUPLING CAPACITOR DIP SOCKETS |
| EIA-540CAAD -- DETAIL SPEC FOR 2 POLE, 5A RELAY SOCKETS |
| EIA-540DBAA -- DETAIL SPEC FOR DECOUPLING CAPACITOR DIP SOCKETS |
| EIA-540B0AA-A -- DETAIL SPEC FOR PRODUCTION BALL GRID ARRAY SOCKET 1.27 MM SPACING |
| EIA-540DAAA-A -- DETAIL SPEC FOR TWO-PIECE CONTACT, DUAL INLINE PACKAGE SOCKETS |
| EIA-540B0AE-A -- DETAIL SPEC LAND GRID ARRAY DEVICES |
| EIA-540CAAB -- DETAIL SPEC RELAY SOCKET 5 AMP BAL AMPERATURE RELY |
| EIA-540ADAA -- DETAIL SPEC-ADAPTER CARRIER QUAD FLAT PACK PIN GRID ARRAY SOCKETS |
| EIA-540CAAC-A -- DETAIL SPECIFICATION FOR 2 POLE, 10 A RELAY SOCKETS |
| EIA-540CAAC -- DETAIL SPECIFICATION FOR 2 POLE, 10A RELAY SOCKETS |
| EIA-540CAAD-A -- DETAIL SPECIFICATION FOR 2 POLE, 5 A RELAY SOCKETS |
| EIA-540CAAE -- DETAIL SPECIFICATION FOR 3 POLE, 10 A RELAY SOCKET |
| EIA-540CAAE-A -- DETAIL SPECIFICATION FOR 3 POLE, 10 A RELAY SOCKETS |
| EIA-700A0AB -- DETAIL SPECIFICATION FOR 68 PIN MEMORY CARD CONNECTORS |
| EIA-700A0AC -- DETAIL SPECIFICATION FOR 88 CIRCUIT DRAM MEMORY CARD INTERCONNECT |
| -- DETAIL SPECIFICATION FOR 8-WAY MODULAR JACKS |
| EIA-540J0AB -- DETAIL SPECIFICATION FOR COIN CELL BATTERY HOLDERS |
| EIA-540J0AA -- DETAIL SPECIFICATION FOR CYLINDRICAL BATTERY HOLDERS |
| EIA-540EAAA -- DETAIL SPECIFICATION FOR ROUND STYLE SOCKETS |
| EIA-540F0AG -- DETAIL SPEC-SMALL OUTLINE DIMM DUAL-IN-LINE MEMORY MODULE SOCKETS |
| EIA-524 -- DIEM. MECH. & ELEC. CHARC...TELEPHONE JACKS |
| EIA-367 -- DIMENSIONAL AND ELECTRICAL CHART. REC. TYPE SOCKET |
| EIA-507 -- DIMENSIONAL CHARACTER DEFINING EDGE CHIPS |
| EIA-453 -- DIMENSIONAL, MECH - ELEC CHAR DEFINING PHONE PLUGS |
| EIA-453 -- DIMENSIONAL, MECHANICAL ELEC PHONE PLUGS AND JACKS |
| EIA-540BAAC -- DS FOR NON-MECHANIC ACTUATED FLEX CARRIER SOCKETS |
| EIA-540FAAF -- DT SP 8-BYTE 168 POSITION DUAL IN-LINE MEMORY MODULE SOCKET 1.27 |
| EIA-540ADAA -- DT SP ADAPTOR-CARRIER QUAD FLATPACK PIN GRID ARRAY SOCK |
| EIA-540JAAA -- DT SP BURN-IN SOCKETS USE W/BALL GRID ARRAY DEVICE USE IN ELEC EQ |
| EIA-540ACAA -- DT SP CHIP CARR SOCKET PLASTIC CHIP CARRIER 1.27MM |
| EIA-540ABAA -- DT SP CHIP CARR SOCKET PLASTIC QUAD FLAT PACK GULL |
| EIA-540FAAE -- DT SP DUAL IN-LINE MEMORY (DIMM) SOCKETS 1.27 MM VERTICAL MOUNT |
| EIA-540FAAE -- DT SP DUAL IN-LINE MEMORY MODULE SOCKET 1.27 MM PITCH VERT MOUNT |
| EIA-540BAAA-A -- DT SP MECHANICALLY ACTUATED SOCKET PIN GRID ARRAY 2.54mm x 2.54mm |
| EIA-540FAAA -- DT SP MULIT-PACKAGE 100 MIL VERTICAL MODULE SOCKETS |
| EIA-540FAAD -- DT SP MULTI-AKG 50 MIL PITCH, ANGLED MOUNT FORMAT MODULE SOCKETS |
| EIA-540FAAA -- DT SP MULTI-PACKAGE 100 MIL PITCH VERT MOUNT FORMAT MODULE SOCKET |
| EIA-540FAAB -- DT SP MULTI-PACKAGE 100 MIL PITCH, ANGLED MODULE SOCKET |
| EIA-540FAAC -- DT SP MULTI-PACKAGE 50 MIL PITCH VERT MOUNT FORMAT MODULE SOCKET |
| EIA-540FAAA -- DT SP MULTI-PKG 100 MIL PITCH VERTICAL MOUNT FORMAT MODULE SOCKET |
| EIA-540FAAB -- DT SP MULTI-PKG 100 MIL PITCH, ANGLED MOUNT FORMAT MODULE SOCKETS |
| EIA-540FAAC -- DT SP MULTI-PKG 50 MIL PITCH VERT MOUNT FORMAT MODULE SOCKETS |
| EIA-540B0AE -- DT SP PRODUCTION LAND GRID ARRAR SOCKET 1.27 MM (0.050IN) SPACING |
| EIA-540B0AB -- DT SPEC BALL GRID ARRAY (BGA) Low PIN COUNT SOCKET FOR USE IN ELE |
| -- DT SPEC LAND GRID ARRAY (LGA) LOW PIN COUNT SOCKET |
| -- FLUX ENTRAPMENT TP |
| EIA-5400000 -- GEN SPEC SOCKETS-INTEGR CIRC USE IN ELECTRONIC EQ. |
| EIA-415-B -- GEN STD SOCKETS USE WITH DUAL/SINGLE-IN-LINE ELEC PACKAGES |
| EIA-5400000-B -- GENERIC SPEC SOCKETS FOR USE IN ELECTRONIC EQUIPMENT |
| EIA-5400000-A -- GENERIC SPECIFICATION FOR SOCKETS FOR USE IN ELECTRONIC EQUIPMENT |
| -- IECQ BLK DET SPEC MULTI-PACK MODULE SOCKET-ELEC EQ |
| -- IECQ GEN SPEC SOCKETS FOR IC PACKAGES FOR USE IN ELECTRONIC EQUIP |
| -- IECQ SEC SPEC FOR SOCKETS FOR IN-LINE PACKAGES FOR USE IN ELEC EQ |
| EIA-444-A -- LEAD SOCKET PANELS |
| -- LEADLESS GRID ARRAY SOCKETS (COMBINED W PN-1358) |
| EIA-506 -- LEADLESS TYPE A CHIP CARRIERS |
| EIA-364-62 -- NEW TP-62 TERMINAL STRENGTH |
| EIA-540B000 -- PIN GRID ARRAY SOCKETS, NEW TITLE 5/2/83 |
| EIA-540B000 -- PIN GRID ARRAY SOCKETS, NEW TITLE 5/2/83 |
| EIA/IS-701 -- PRODUCTION BALL GRID ARRAY (BGA) SOCKET TEST SPECIFICATION |
| EIA-540FAAC -- RAFFIRM, DT SP MULTI-PACKAGE 50 MIL PITCH VERTICAL MOUNT SOCKETS |
| EIA-540C000 -- REAFF EIA-540C000, SEC SP SOCKET FOR RELAY FOR USE IN ELECT EQ |
| EIA-540CA00 -- REAFF EIA-540CA00, BLANK DETAIL SPECIFICATION ON RELAY SOCKETS |
| EIA-540CAAA -- REAFF EIA-540CAAA, DT SP RELAY SOCKET-10A BALANCE ARMATURE RELAY |
| EIA-540CAAB -- REAFF EIA-540CAAB, DT SP RELAY SOCKETS-5A BALANCED ARMATURE RELAY |
| EIA-540AD00 -- REAFFIRM - BK DT SP ADAPTOR CARRIER QUAD FLAT PACK PIN GRID ARRAR |
| EIA-540AB00 -- REAFFIRM - BK DT SP CHIP CARRIER SOCKET PLASTIC QUAD FLAT PACKAGE |
| EIA-540AA00 -- REAFFIRM - BK DT SP CHIP CARRIER SOCKETS-LEADLESS TYPE A,B,D |
| EIA-540DA00 -- REAFFIRM - BK DT SP DUAL IN-LINE SOCKETS FOR USE IN ELECT EQUIP |
| EIA-540BA00 -- REAFFIRM - BK DT SP SOCKET PIN GRID ARRAY 2.54 X 2.54 MM |
| EIA-540AC00 -- REAFFIRM - BK DT ST CHIP CARRIER SOCKET PLASTIC CHIP J TYPE LEADS |
| EIA-540AAAA -- REAFFIRM - DT SP CHIP CARRIER SOCKET LEADLESS TYPE A 1.27 MM SPAC |
| EIA-540ABAA -- REAFFIRM - DT SP CHIP CARRIER SOCKETS PLASTIC QUAD FLAT 0.635 MM |
| EIA-540DAAB -- REAFFIRM - DT SP FLEXIBLE CARRIER 2 PIECE DUAL IN-LINE SOCKETS |
| EIA-540CAAC -- REAFFIRM - DT SP FOR 2 POLE, 10 A RELAY SOCKETS |
| EIA-540CAAD -- REAFFIRM - DT SP FOR 2 POLE, 5 A RELAY SOCKETS |
| EIA-540BAAC -- REAFFIRM - DT SP NON-MECH ACTUATED FLEXIBLE CARRIER SOCKET |
| EIA-540ACAA -- REAFFIRM - DT SP PLASTIC CHIP CARRIER FAMILY 1.27 MM (0.50") LEAD |
| EIA-540CAAE -- REAFFIRM - DT ST FOR 3 POLE, 10 A RELAY SOCKETS |
| EIA-540D000-A -- REAFFIRM - SEC SP FOR IN-LINE PACKAGE SOCKET FOR USE IN ELEC EQ |
| EIA-540F000 -- REAFFIRM - SEC SP MULTI-PACKAGE MODULE SOCKETS USE IN ELECT EQUIP |
| EIA-540A000-A -- REAFFIRM - SEC SP SOCKETS FOR CHIP CARRIERS USE IN ELECTRONIC EQ |
| EIA-540B000 -- REAFFIRM - SEC SP SOCKETS PIN GRID ARRARY 2.54 X 2.54 MM |
| EIA-540BAAB -- REAFFIRM -DT ST NON-MECH ACTUATED PIN GRID ARRAY 2.54MM X 2.54 MM |
| EIA-540FAAD -- REAFFIRM, DT SP MULTI-PACK 50 UM PITCH ANGLED FORMAT MODULE SOCKE |
| EIA-540FAAC -- REAFFIRM, DT SP MULTI-PACKAGE 50 MIL PITCH VERTICAL MOUNT SOCKETS |
| CB5 -- RECOMM TEST PROC SEMICONDUCTOR THERMAL DIS DEVICES |
| EIA-156-B -- RESCIND EIA-156-B, BATTERY SOCKET PATTERN |
| EIA-167-C -- RESCIND EIA-167-C, TYPE DESIGNATION FOR RECEIVER TYPE TUBE SOCKET |
| EIA-367 -- RESCIND EIA-367, DIMENS ELEC CHAR DEFINING RECEIVER TYPE SOCKETS |
| EIA-367-1 -- RESCIND EIA-367-1, DIMENS ELEC CHAR DEFINING RECEIVER TYPE SOCKET |
| EIA-415-1 -- RESCIND EIA-415-1, APPLICATION GUIDE FOR IC SOCKETS |
| EIA-415-B -- RESCIND EIA-415-B, SOCKETS USED WITH DUAL AND SINGLE-IN-LINE PKGS |
| EIA-444-A -- RESCIND EIA-444-A, LEAD SOCKET PANELS FOR USE W/INTEGRATED CIRC |
| EIA-453 -- RESCIND EIA-453, DIMENS, MECH, ELEC CHAR DEFINING PHONE PLUG JACK |
| EIA-486 -- RESCIND EIA-486, SOLDER WICKING TEST PROCEDURE FOR SOCKETS |
| EIA-488 -- RESCIND EIA-488, SOCKETS, INDIVIDUAL LEAD TYPES |
| EIA-489 -- RESCIND EIA-489, PLUG-IN ELECRONIC COMPONENTS, ROUND STYLE |
| EIA-506 -- RESCIND EIA-506, DIMENSIONAL CHAR SOCKETS LEADLESS TYPE A CHIP |
| EIA-507 -- RESCIND EIA-507 DIMENSION CHARACTERISTICS DEFINING EDGE CHIPS |
| EIA-524 -- RESCIND EIA-524 DIMENSION MECH ELEC CHAR DEFINING RIGHT ANGLE |
| -- RESCISSION OF RS-427 |
| -- RESISTANCE TO SOLDERING SURFACE MOUNT CONNECTORS |
| EIA-540D000-A -- REV 540D000 SEC SPC FOR IN-LINE PACKAGE SOCKET |
| EIA-540DAAA -- REV EIA540D0AA DT SPC DUAL IN-LINE 2 PIECE CONTACT |
| EIA-540D000-A -- REV OF EIA-540D000 SEC SPEC FOR IN-LINE PACKAGE SOCKETS |
| EIA-444-A -- REVISION OF RS-444 |
| EIA-540H000 -- SEC SP BURN-IN SOCKETS USED WITH BALL GRID ARRAY DEVICES |
| EIA-540G000 -- SEC SPEC FOR BURN-IN SOCKET USE IN ELECTRONIC EQUIPMENT |
| -- SEC SPEC FOR MEMORY CARD CONNECTORS FOR USE IN ELECTRONIC EQUIP |
| EIA-540F000 -- SEC SPEC MULTI-PACKAGE MODULE SOCKETS FOR USE IN ELECTRIC EQUIP |
| EIA-540E000 -- SEC SPEC ROUND STYLE SOCKETS |
| EIA-540A000 -- SEC SPEC SOCKETS - CHIP CARRIERS - USE IN ELEC EQ |
| EIA-540C000 -- SEC. SPEC. FOR SOCKETS, RELAYS-USE IN ELEC EQUP. |
| -- SEC. SPEC. ON QUAD FLAT PACK SOCKETS |
| EIA-540E000 -- SEC. SPEC. ON ROUND (TO) SOCKETS |
| EIA-540D000 -- SEC. SPEC. SOCKETS FOR DUAL-IN-LINE IN PACKAGES |
| EIA-540A000-A -- SECT. SPEC - SOCKET - CHIP CARRIER USE IN ELEC EQ |
| EIA-540G000 -- SECTIONAL SPEC BURN-IN SOCKETS |
| EIA-540J000 -- SECTIONAL SPECIFICATION FOR BATTERY HOLDERS |
| -- SINGLE IN-LINE PACKAGE SOCKET |
| EIA-488 -- SOCKET IND. LEAD TYPES ETC. |
| EIA-489 -- SOCKET, PLUG-IN ELECTRONIC, ETC. |
| -- SOCKETS & CONNECTORS FOR TERMINATING TO ROUND ETC |
| EIA-489 -- SOCKETS PLUG-IN ELECTRIC COMPONENT ROUND TYPE |
| EIA-488 -- SOCKETS, INDIVIDUAL LEAD TYPES |
| EIA-507 -- SOLDER CLIPS FOR CHIP CARRIERS |
| EIA-486 -- SOLDER WICKING TP FOR SOCKETS |
| EIA-486 -- SOLDER WICKING TP FOR SOCKETS |
| EIA-676 -- SPEC FOR SMALL FORM FACTOR 45.7 MM (1.8 IN) DISK DRIVE 15 MM HIGH |
| EIA-741 -- SPEC SMALL FORM FACTOR 133.35 MM (5.25 IN) DISK DRIVE |
| EIA-677 -- SPECIFICATION - SMALL FORM FACTOR POWER CONNECTOR PIN DIMENSIONS |
| EIA-675 -- SPECIFICATION FOR SMALL FACTOR 1.3 INCH DISK DRIVES |
| EIA-676 -- SPECIFICATION FOR SMALL FACTOR 1.8 INCH DISK DRIVES |
| EIA-674 -- SPECIFICATION FOR SMALL FORM FACTOR 1.8 INCH DISK DRIVES |
| EIA-741 -- SPECIFICATION FOR SMALL FORM FACTOR 133.35 MM 5.25 IN DISK DRIVES |
| EIA-720 -- SPECIFICATION FOR SMALL FORM FACTOR 2.5" DISK DRIVES |
| EIA-740 -- SPECIFICATION FOR SMALL FORM FACTOR 3.5" DISK DRIVES |
| EIA-675 -- SPECIFICATION FOR SMALL FORM FACTOR 33.0 (1.3 IN) DISK DRIVES |
| EIA-674 -- SPECIFICATION FOR SMALL FORM FACTOR 45.7 MM (1.8 IN) DISK DRIVES |
| EIA-741 -- SPECIFICATION FOR SMALL FORM FACTOR 5.25" DISK DRIVES |
| EIA-740 -- SPECIFICATION FOR SMALL FORM FACTOR 88.9 MM 3.5 IN DISK DRIVES |
| EIA-677 -- SPECIFICATION FOR SMALL FORM FACTOR POWER CONNECTOR PIN DIMENSION |
| EIA-677 -- SPECIFICATION FOR SMALL FORM FACTOR POWER CONNECTOR PIN DIMENSION |
| -- SPECIFICATION FOR SMALL FORM FACTOR POWER CONNECTOR PIN DIMENSION |
| EIA/IS-46 -- TEST PROCEDURE RESISTANCE SOLDERING |
| EIA-364-17A -- TP-17A TEMPERATURE LIFE WITH/WITHOUT ELECTR LOAD TEST PROCEDURE |
| EIA-364-47 -- TP-47 CONDUCTOR UNWRAP TP FOR SOLDERLESS WRAPPED ELECT CONTACTS |