General Sessions
S-1 General Session- This meeting will be on Tuesday afternoon at 1:30 pm. The session engages user issues such as material supplies availability, manufacturing/production-related issues, and industry-wide aspects of product distribution channels.
Awards Luncheon - The Tuesday lunch includes presentation of ECA Engineering Awards and a guest luncheon speaker.
Tuesday Dinner - On Tuesday evening, all attendees and their guests are invited to a reception and dinner. Peers and colleagues can enjoy a social experience and also be enlightened with a keynote session (to be announced shortly).
Lunches and Dinner - All attendees are invited to attend these common functions and meet and greet their colleagues and peers. These functions are all included in the Full Summit Fee.
The 2008 Engineering Fall Summit meetings offers more than an excellent opportunity to network with the technical leaders setting the standards for our industry. There is also a full slate of informational programs on the critical issues before the passive components industry which you should attend.
Keynotes & Featured Presentations:
Tuesday, October 7th, 8:00 am – 12:00 Noon
8:00 – 10:00 AM William Cutler
Plant Manager, Ceramics Facility
Bourns, Inc. Logan, UT
"Competing in a World-Wide Market in the 21st century."
Are your products and services just staying competitive or leading the industry?
• Competition in the future
• How to beat the competition
• Quality and Reliability improvements in manufacturing processes.
• Customer Satisfaction in Service
• Summary
• Q & A
10:00 – 12:00 Noon
Robert C. Pfahl, Jr.
Vice President of Operations
International Electronics Manufacturing Initiative (iNEMI)
Herndon, VA
“A Snapshot of New Findings on Passive Components in the 2009 iNEMI Roadmap” including discussion of :
• Business Issues
• System Packaging Evolution
• More than Moore
• Component Trends & Needs”
• Capacitor types and location
• inductors & transformers
• Alternative Technologies (embedded passives)
• Green Materials and Energy Efficient
12:00 Noon - 1:30pm
"Competition & Safety in Components Industry"
Robert Willis, President, Electronic Components Association, Arlington, VA
1:30 - 4:30pm
Ultracapacitors: A Mainstream Energy Storage and Power Delivery Solution
Mike Everett, VP & CTO, Maxwell Technologies
- Ultracapacitor technology, energy storage capability and automotive trends -
- Role & activities of KiloFarad International
- Opportunities in design & deployment
Michael Everett has been the Co-Chairman of the Board of Directors for Kilofarad International since 2006. During that time Mike has also functioned as the Regulatory Working Group Chairman inside KFI. Mike is the Chief Technology Officer at Maxwell Technologies Inc. a manufacturer of ultracapacitors and ultracapacitor products among other technologies. Mike is responsible for all new energy storage technology development at Maxwell. He has worked for the company for over 6 years and held positions in Product Assurance, Product Development and Research and Development during his time there. Prior to coming to Maxwell, and over his 25 year career in engineering and technology development, Mr. Everett has held various engineering and management positions at high tech capital equipment manufacturing companies.
Wednesday, October 8th, 8:00 – 10:00 AM -- Workshop
Title: "Tape & Reel Packaging: Review of Changes to Industry Standards”
Presented By:
• Bill Aldeen, President of Nu-Way Electronics, and a member of the "Automated Component Handling" Committee of the Electronic Industries Alliance (EIA).
• Scott Carter, Vice President of Tek Pak and chairman of the "Automated Component Handling" Committee.
Summary: In 2008, EIA issued new versions of the standards for Surface Mount Tape & Reel Packaging (EIA-481) and Radial Tape & Reel Packaging (EIA-468). The revised standards incorporate major innovations and will have significant impact on the producers and users of electronic components. The program will review both new standards and highlight the changes from previous versions. The presenters are experienced practitioners who have been involved in the creation of the new standards. They will answer questions about the reasons for the changes and the impact on the industry. They will also welcome feedback on the standards to identify future enhancements.
Topics include:
--Orientation of SMT devices in carrier tape
--Measurement of "camber" in SMT carrier tape
--Overview of Radial standard, which has been completely rewritten
--Radial lead spacing and pitch options
--Seek suggestions for future changes to standards
Of interest to:
--Manufacturing engineers and machine operators
--Buyers of taped components
--Design engineers in SMT and through-hole technology
--Component manufacturers
--Manufacturers of packaging materials, such as carrier tapes, adhesive tapes, and reels
The Speakers:
Bill Aldeen is the President of Nu-Way Electronics of Elk Grove, Illinois, which provides tape & reel packaging service, cable assembly, and other products and services for the electronics industry.
Scott Carter is the chairman of the "Automated Component Handling" Committee of the Electronic Industries Alliance (EIA). Scott has been Vice President of R&D at Tek Pak, Inc. of Batavia, Illinois, since 1996. Tek Pak provides thermoforming solutions for the electronics, medical, heathcare, food and consumer markets. Prior to joining Tek Pak, Scott worked in the field of energy research at the University of Kentucky's Center for Applied Energy Research.
