Program

Schedule

Monday, October 6
9:00 am - 4:00 pm	Registration
9:00 am - 5:00 pm	CE-2.0 National Connector Standards (part 1)
9:00 am - 12:00 Noon	Ceramic Working Group
12:00 Noon - 1:00 pm	Box Lunch
1:00 pm - 2:30 pm	P-14 Overcurrent Protection Devices
2:30 pm - 4:00 pm	Tantalum Working Group
6:30 pm - 8:00 pm	Welcome Reception*
Tuesday, October 7
7:30 am - 4:30 pm	Registration
8:00 am - 12:00 Noon	Summit Keynote Presentations (1) & (2)
(1) 8:00 - 10:00 am...	Competing in a World-wide Market in the 21st Century William Cutler, Bourns
(2) 10:00 - 12:00 Noon...	A Snapshot of New Findings on Passive Components in the 2009 iNEMI Roadmap Robert C. Pfahl, Jr., iNEMI
12:00 Noon - 1:30 pm	Awards Luncheon *
1:30 pm - 4:30 pm	CE-2.0 (Part 2)
1:30 pm - 4:30 pm	S-1 General Session
4:30 pm - 5:30 pm	P-10 Integrated Passive Devices
6:00 pm - 9:00 pm	Reception/Dinner*
Wednesday, October 8
7:30 am - 12:00 Noon	Registration
8:00 am - 10:00 am	Summit Keynote Presentation Tape & Reel Packaging: Review of Changes to Industry Standards Bill Aldeen, Nu-Way Electronics & Scott Carter, Tek-Pak
10:00 am - 11:00 am	P-1 Resistive Devices
10:00 am - 12:00 Noon	Soldering Technology Committee (part 1)
11:00 am - 12:00 Noon	P-2.2 Aluminum, Film and Mica Capacitors
12:00 Noon - 1:00 pm	Lunch (Working Lunch* for P-2.1 Ceramic Dielectric Capacitors)
1:30 pm - 2:30 pm	Soldering Technology Committee (part 2)
1:30 pm - 2:30	P-3 Inductive Components
1:30 pm - 2:30 pm	P-2.5 Tantalum Capacitors
3:30 pm - 5:30 pm	P-4 Mechanical Outlines
5:30 pm - 6:30 pm	Standards & Technology Policy Council (STPC)
Thursday, October 9
8:00 am - 12:00 Noon	Automated Component Handling Meeting
8:00 am - 10:00 am	P-4 Mechanical Outlines (part 2, if needed)