The 58th Electronic Components Technology Conference (ECTC) was held May 27 -30, 2008 in Lake Buena Vista, Florida.  More than 950 attendees in packaging, components and microelectronic systems engineering and technology participated in the four-day event featuring sessions covering a wide spectrum of topics in advanced packaging, system packaging, materials, processing, assembly and manufacturing for electronic systems and technologies. ECTC is co-sponsored by the IEEE Components, Packaging and Manufacturing Technology Society (CPMT) and the Electronic Components Association (ECA).

Next stop information exchange

ECTC provides conference attendees with three crucial parts: the technical program, the professional development courses, and the technical exhibition corner.  There was no shortage of information exchange that flowed through over 340 technical papers that were presented in 36 oral sessions, two poster sessions and a special student poster session. Papers covered a wide spectrum of topics: including advanced packaging, system packaging, interconnections, electronic components, materials, processing, assembly, manufacturing, optoelectronics, quality, reliability, modeling, and simulation.  Special sessions in this year’s technical program focused on nano-technology and biomedical research and development. 

The technical program and professional development courses were supplemented by the technical exhibition corner where more than 50 companies, in the electronic components, materials, thermal, and packaging fields, exhibited their latest technologies and products.   Conference attendees and exhibitors were also provided with numerous informal networking opportunities through receptions, conference session and lunch breaks. 

ECTC continues to be an essential show for the electronic component industry.  The 59th ECTC will be May 26- 29, 2009, hosted at Sheraton San Diego Hotel & Marina, San Diego, CA.