CARTS USA

"The conference inspires ideas for new products as well as provides a venue, that is unparalleled, for technical discussions with peers, customers and vendors."

Monday - Seminars
Monday, March 15
10:00 am - 12:00 pm	TECHNICAL SEMINAR: Impact of Advanced Nano Technology on Passive Component Developments Chairman: Dr. Gordon Dayton, Vishay Vitramon Since turning the corner on the 90’s there has been a relentless drive to increase the functionality of portable electronic devices as well as other types of electronic equipment in the consumer, computer and communication markets. This revolution has placed great demands on the material systems used to produce the components that support the architectural backbone of these innovations. As feature sizes have decreased and volumetric efficiency demands have increased nano-scale materials have been developed to meet these challenges. The first use of nanotechnology within the capacitor industry was in tantalum capacitors back in the 1980's. There were also instances of the use nanotechnology based on the "Ceramic Fever" initiatives of the 1970's to produce better dielectrics and electrode materials. This seminar will address the mechanics of nanotechnology that made this dramatic improvement happen and review some of the opportunities that will arise for the passive components industry in the foreseeable future. Papers by: A. Rae, TPF Enterprises; B. Foster, Foster Rush Consulting; S. Lee, R. D. Levi, M. Samantaray, S-H. Yoon, W. Qu, C. A. Randal, The Pennsylvania State University and Samsung Electro-Mechanics Co. Ltd; Satish Kumar, Centre for Materials for Electronics Technology.

2:00 pm - 5:00 pm	MARKET SEMINAR : What to Expect in 2010 Macro Economic Trends affecting the economy and the relation to the electronics industry. UBS (invited) 2010 China/Southeast Asia Electronics Market Outlook including the Chinese government initiative on energy conservation, their solutions to stimulate the domestic Chinese professional electronics markets, and the projected impact on the passive components supply chain for high performance and energy efficient parts. Amy Wang, China Outlook Consulting Global Markets for Raw Materials Consumed in the Passive Component Industry: 2010-2014 - This informative presentation covers the markets for critical raw materials consumed in the worldwide capacitor, resistor and inductor industries worldwide. All information presented is compiled from multiple market research studies on the subject of feedstock and engineered materials consumption in the global passive component industry conducted by Paumanok Publications, Inc. from 1988 to 2009. Dennis Zogbi, Paumanok Publications
Tuesday - Wednesday - Thursday Symposium
Tuesday, March 16
8:45 - 9:00 am	Welcome and Awards
9:00 - 9:30 am	*Keynote - What is Happening to the Long Term Life of MLCCs?* C. Hendricks, Intel
9:30 am - 12:00 pm	Session 1: Unique Packaging Approaches Chairman: Randy Townley, Lockheed Martin Space Systems
1.1	Stacked Multi-Layer Ceramic Capacitors for High Reliability Applications; (view abstract) J. Bultitude, J. McConnell, A. Gurav, T. Ashburn, J. Franklin, J. Zavala, L. Jones, R. Phillips, X. Xu, J. Magee, M. Laps, KEMET Electronics
1.2	Characterization of Embedded Capacitors; (view abstract) I. Bord, Y. Ousten, C. Blot, B. Levrier, L. Bechou,P. Kertez, Laboratoire IMS-UMR CNRS, THALES Systèmes Aéroportés
1.3	Effect of Soldering-Induced Stresses on Characteristics of Large Chip Ceramic Capacitors; (view abstract) A. Teverovsky, PSGS/GSFC
1.4	Ultra Thin Discrete Capacitors for Emerging Embedded Technologies; (view abstract) R. Uher, AVX Czech Republic
1.5	High Dielectric Constant Polymer Film Capacitors; (view abstract) S. Zhang, Strategic Polymer Sciences Inc.
12:00 pm	Lunch with Exhibits
2:00 - 5:00 pm	Session 2: Design and Construction Chairman: Michael Cozzolino, Raytheon Space Systems
2.1	Anode Lead Wire Pre-Treatments for Improving Lead Wire Bonding in Tantalum Capacitor Anodes Processes; (view abstract) M. Hintz, Medtronic Energy and Components Center
2.2	MIL-PRF-55342 Resistor Long Life Drift; (view abstract) P. Cossaboon, K. Koether, Lockheed Martin Space Systems Company
2.3	Low Voltage CV Loss in Ta Capacitors; (view abstract) Y. Freeman, Ph. Lessner, Q. Chen, T. Kinard, J. Qazi, Kemet Electronics; E. Dickey, J. Li; Center for Dielectric Study (CDS) at the Pennsylvania State University; J. Koenitzer, L. Mann, Cabot Supermetals
2.4	Capacitor EDA Models with Compensations for Frequency, Temperature, and DC Bias; (view abstract) J. Prymak, P. Blais, W. Buchanan, E. Chen, K. Lai, G. Malagoli, A. Mayar, M. Niskala, A. Schmidt, P Staubli, B. Vildaver, Kemet Electronics
2.5	Optimizing Low Pass Filter Bandwidth for Generating Electrical Duobinary Signal for 40 Gb/s Optical Duobinary Systems; (view abstract) A. Rahman, M. Howieson, Thin Film Technology
2.6	Large Size Multilayer Ceramic Capacitors, Challenge and Approach; (view abstract) F. Wei, Pacifitec Design Inc.
2.7	Film Capacitors: High Voltage, High Energy, High Current; (view abstract) J. Ennis, F. MacDougall, X. Yang, C. Naruo, M. Schneider, R. MacDonald, R. Cooper, J. Gilbert, General Atomics Electronic Systems
5:30 - 7:00 pm	Exhibits and Reception
Wednesday, March 17
7:00 am	Registration
8:30 am - 12:00 pm	Session 3: New Applications and Practices Chairman: John Prymak, Kemet Electronics
3.1	Can ESR Be Too Low?, (view abstract) E. Reed, KEMET Electronics
3.2	Have Recent Advances in BME Technology Leveled the C.O.T.S. Playing Field for Capacitors?, (view abstract) D. Jordan, J. Ling, B. Chen, HolyStone International
3.3	Performance of Aluminium Electrolytic Capacitors and Influence of Aluminium Cathode Foils, (view abstract) Z. Dou, R. Xu, A. Berduque, BHC Components; J. Qazi, C. Prince, Kemet Electronics
3.4	The Hidden Component to High Speed Filter Design: The Foot Print Influence, (view abstract) A. Howieson, M. Broman, Thin Film Technology
3.5	Power Dissipation Considerations in High Precision Chip Resistors and Networks, (view abstract) D. Vignolo, Vishay / Sfernice Division
3.6	Film Technology Advantages in Wind Power Applications, (view abstract) C. Reynolds, AVX Corporation
3.7	An Evaluation of Current Dielectric Materials in High Temperature Environments; (view abstract) A. Polotai, S. Maher, J. M. Wilson, R. G. Maher, MRA Laboratories
3.8	Design and Implementation of a Compact Interleaved Boost Converter; (view abstract) H. Kosai, UES Inc.; S. McNeal, B. Jordan, J. Scofield, Jared Collier, AF Research Lab; B. Ray, Bloomsburg Univ. of PA
12:00 pm	Lunch with Exhibits
2:00 - 5:00 pm	Session 4: Reliability and Test Chairman: Erik Reed, Kemet Electronics
4.1	Reliability Requirements for CPU Decoupling MLCCs, (view abstract) C. Hendricks, Intel Corporation
4.2	Screening and Qualification Testing of Chip Tantalum Capacitors for Space Applications, (view abstract) A. Teverovsky, PSGS/GSFC
4.3	Reliability of Passive Electronic Devices: Failure Mechanisms, Testing and Reliability, (view abstract) V. Sedlakova, J. Sikula, J. Majzner, M. Kopecky, Brno University of Technology
4.4	Study of Low Leakage Failure Mechanism of Multilayer X7R MLCCs, (view abstract) Z. Wang, International Rectifier Corp
4.5	Leakage Current and Noise reliability indicators for Ta and NbO Low Voltage Capacitors, (view abstract) J. Sikula, V. Sedlakova, H. Navarova, J. Majzner, Brno University of Technology; M. Tacano, Meisei University, T. Zednicek, AVX Czech Republic
4.6	Software and Hardware Combine to Produce a Flexible, Passive-component Test System; (view abstract) B. Frost, Applied Relay Testing Ltd.
4.7	Physical and Electrical Characterization of Aluminum Polymer Capacitors; (view abstract) D. Liu, MEI Technologies, Inc. NASA Goddard Space Flight Center
Thursday, March 18
8:30 am - 11:30 am	Session 5: High Stress Applications and Designs Chairman: Paul Cossaboon, Lockheed Martin
5.1	High-Voltage Multilayer Polymer Aluminum Electrolytic Capacitors with Polypyrrole as Cathode Materials, (view abstract) K. Zhang, Fujian Guoguang Research Institute of Advanced Electronic Components & Material Technologies
5.2	SMD Tantalum Capacitors Break Limit of 200ºC for Continuous Operation, (view abstract) R. Faltus, AVX Czech Republic
5.3	Reliability Indicators of High Voltage MLCCs Based on Leakage Current and Noise Spectral Density, (view abstract) M. Tacano, H. Ohya, Y. Morohoshi, N. Tanuma, Meisei University, V. Sedlakova, J. Sikula, Brno University of Technology
5.4	Heavy Duty Capacitors for High Humidity Conditions, (view abstract) F. Gonzalez, G. Saldua-Price, EPCOS AG Spain
5.5	Evaluation of Fluorenyl Polyester Film Capacitors; (view abstract) J. Stricker, J. DeCerbo, N. Brar, S. McNeal, H. Kosai, T. Bixel, W. Lanter, USAF Research Lab; B. Ray, Bloomsburg University of Pennsylvania
5.6	Interface Effects in Metal Oxynitride Capacitors; (view abstract) K. Bray, UES, Inc.
11:30 am	End of CARTS USA 2010