2008 CARTS Europe Conference Program

5 reasons why CARTS Europe 2008 will more than repay your investment

FACT: CARTS Europe is the only event in Europe devoted exclusively to passive electronic components.

1. It provides the only technical seminar that in one day enables you to gain an overview of the important new technologies defining the industry.

2. The marketing seminar gathers together the experts on the hottest topics in the European and worldwide markets, while also providing leading edge intelligence for the future.

3. The symposium is the one opportunity in Europe to get an in-depth examination of technologies that will impact worldwide design, engineering and production – from Europe’s and the world’s leading technical experts.

4. It’s the foremost networking venue in Europe for meeting and exchanging information with the finest minds in passive components.  

5. Registration includes free membership in CARTS International providing access to a wealth of passive component resources.

Seminar 1: Embedded and Integrated Active and Passive Electronic Components 
TechSearch International Inc., Grand Joint Tech., Ltd.

08:30 – 12:00

The introduction of embedded active components with embedded and integrated passives may be the most significant development in the electronics industry since the introduction of micro-via technology.  The seminar will address both embedded active and passive devices in packages, modules, and printed circuit boards including the differences between formed and placed components and insight into the drivers for the adoption of each technology.  Alternatives to embedding in laminate substrates are also reviewed.

Note: All attendees will receive the Seminar 1 Notes.

FACT: CARTS Europe 2008 sponsors have 20 years of experience in providing the premier forum for technical interchange, marketing expertise, and networking with the industry’s best and brightest.

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Seminar 2: Electronic Components 2008
Dennis Zogbi, Paumanok Publications
Analyst, DfR Solutions

14:00 – 17:00

Today’s electronics continue to pack more punch into smaller and smaller footprints. Billions of electronic components must be manufactured to meet these demands. And, as always, manufacturers need to deliver greater performance at lower prices. What’s inside these tiny techno-wonders and can they really be produced at costs consumers are demanding? Who are the players in this movement and what has to be done to achieve success?

DfR Solutions will discuss the use passive technology in today’s multi-core processors including specific applications of discrete components. And, Paumanok’s Dennis Zogbi returns to CARTS Europe to share his one-of-a-kind analysis and predictions on where the passive electronic components industry is heading and what it will take to get there.

Note: All attendees will receive the Seminar 2 Proceedings including the market presentation from Paumanok Publications.

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09:00 - 09:45
Passive Component Manufacturers in Rapidly Changing Telecommunications World
T. Suorsa, S. Vasala, Nokia Siemens Network

This merger of two major corporations, Nokia and Siemens, presented challenges in maintaining harmony in the combined electronic components supplier base. The speakers provide a unique perspective from the new Nokia Siemens Networks Nokia Siemens Networks on what direction the company is going and where the unique opportunities are going to be. This presentation promises to generate a lively discussion for both attendees and the speakers.

1.1 Electrical Characterization of Polymer Tantalum Capacitors; Y. Freeman, W. R. Harrell, I. Luzinov, B. Holman, Kemet, USA

1.2 High CV Tantalum Capacitors – Challenges and Limitations; S. Zednicek, I. Horacek, J. Petrzilek, P. Jacisko, P. Gregorova, T. Zednicek, AVX, Czech Republic

1.3 High Voltage Tantalum Polymer Capacitors; J. Young, Kemet, USA

1.4 Evaluation of Broadband Filters for 24GHz Application Using LTCC Technology; V. Napijalo, TDK Electronics, Ireland

1.5 Broadband Antenna Design for Multiband WiMax Applications; D. Humphrey, TDK Electronics, Ireland

2.1 The Development of Electrolytes in Aluminum Electrolytic Capacitors for Automotive and High Temperature Applications; 
Z. Dou, R. Xu, A. Berduque, BHC Components LTD (Kemet), UK

2.2 Thermal Design of Power MLCCs; S. Tsubota, Murata Europe Management B.V., Netherlands

2.3 Film Capacitors for Automotive and Industrial Applications;
D. Montanari, A. Sanua, M. Tsingos, Arcotronics Group (Kemet), Italy, K. Saarinen, M. Niskala, C. Nender, Evox Rifa Group Oyj (Kemet), Finland, D. Zeidler, Arcotronics Group (Kemet), Germany

15:30 - 16:15
Tutorial: Discrete Resistor Technologies and Potential Future Advancement; M. Brikett, TT Electronics Welwyn Components LTD, UK

16:15 - 17:00
Tutorial - Special Capacitor Application Considerations;
J. Prymak, Kemet USA

09:00 - 12:00
Session 3: Circuit Designs
Chairman: Roger Olsson, Saab Group

3.1 Equivalent Circuit Models for Discrete Passive Components;  M. Andersson, Nokia, Finland

3.2 Method for Determining the Q of an Acoustic Resonator at the Resonance and Anti-Resonance Frequency; B. Kearns, TDK Electronics, Ireland

3.3 Adding Manufacturing Process Tolerances to Lumped Equivalent Circuit Models of LTCC Helical Inductor;
V. Napijalo, TDK Electronics, Ireland

3.4 DC-Link Capacitors for Industrial Applications;
R. Garcia-Rojo, EPCOS Electronic Components S.A., Spain

3.5 Embedded Discrete Passive Components in PCBs using IMB Technology; T. Waris, T. Karila, P. Hilden, J. Moisala, Imbera Electronics Oy, Finland

3.6 DC/DC Converter Output Capacitor Benchmark;
R. Faltus, Z. Flegr, R. Sponar, M. Jane, T. Zednicek, AVX, Czech Republic

FACT: This is the only conference that brings international experts from the passive electronic components industry to the European stage.

14:00 - 15:10
Session 4: Materials & Processes
Chairman: Dr. Josef Skula, Brno University

4.1 The Next Generation of Carbon and Silver Ink Systems for Low ESR Polymer Tantalum Capacitors;  M. Sica, Johnson Matthey Plc, UK

4.2 Challenge: Highest Capacitance Tantalum Powders; 
H. Haas, C. Schnitter, N. Sato, H. Karabulut, H.C. Starck GmbH, Germany, Y. Fujimori, O. Thomas, H.C. Starck GmbH, Japan

4.3 A New Era for High CV/g Ta Powders;  J. Koenitzer, T. Izumi, L. A. Mann, Cabot Supermetals, USA

15:30 - 17:30
Session 5: Reliability Approaches
Chairman: Knud Blohm, Danfoss A/S

5.1 Field Crystallization in Tantalum Capacitors, DCL and Reliability: T. Zednicek, H. Leibovitz, AVX, J. Sikula, Brno University

5.2 Tantalum and Niobium Oxide High Voltage Capacitors: Field Crystallization and Leakage Current Kinetics;  J. Sikula, V. Sedlakova, H. Navarova, J. Hlavka, Brno University of Technology, Czech Republic

5.3 Reliability of Ceramic Capacitors Subject to High Temperature in Automotive Environment; Y. Ousten, IMS, France

5.4 Low Frequency Noise Measurements as a Figure of Merit Indicator for MLCC in Comparison with Another Capacitors;
M. Tacano, N. Tanuma, Meisei University, Japan, M. Kikuchi, S. Tanahashi, Kyocera Central Research Lab., Japan, J. Sikula, Brno University of  Technology, Czech Republic

5.5 Flexible Termination – Reliability in Stringent Environments;
B. Sloka, P. Staubli, K. Lai, A. Hill, J. Prymak, C. Riedl, P. Blais, Kemet, USA

08:30 - 11:30
Session 6: Design & Construction
Chairman: Dr. Tomas Zednicek, AVX CZ

6.1 Electrochemically Polymerized Poly-Pyrrole (PPy) as Cathode Material for Multilayer Polymer Aluminum;
Y. Zhang, Fujian, China

6.2 The Influence of Electrowetting and Surfactants on MnO2 Coverage and in Electrical Properties of Ta;
A. Pimentel, Kemet, Portugal

6.3 Balanced Bandpass Filter with Tuned Common Mode Impedance; B. Kearns, TDK Electronics, Ireland

6.4 The Application of New Generation Cathode Foil in Aluminum Oxide-Electrolytic Capacitors; L. V. Missozhnikov, I. N. Yurkevich, OKB “TITAN”, Ltd., Russia

6.5 Soft Termination for MLCCs; S. Ikarashi, Namics Corp., Japan

6.6 Benchmarking of TDK LTCC Circuits up to 40GHz and Comparison with EM Simulation; D. Humphrey, TDK Electronics, Ireland

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FACT: 100% of past attendees say that the CARTS conference is worth the investment.

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